SK Group Chairman Chey Tae-won announced at Computex in Taipei that memory chip subsidiary SK Hynix will double its wafer production capacity over the next five years. The ambitious plan comes as AI-driven demand for high-bandwidth memory (HBM) continues to surge, and Chey reiterated an earlier warning that global chip wafer supply bottlenecks could persist until 2030.
SK Hynix already dominates the HBM market with a 58% share in Q1 2026, according to Counterpoint Research, while rivals Samsung Electronics and Micron Technology each held 21%. Last week, the company’s market value surpassed $1 trillion for the first time, joining Samsung and Micron in that milestone.
Chey made clear that SK Hynix aims to become a primary HBM supplier for Nvidia's upcoming Vera Rubin AI system. “There’s only one customer for HBM4E right now,” he noted, referring to Nvidia. To support this goal, the company is seeking broader partnerships in Taiwan beyond its existing relationship with TSMC.
Goldman Sachs raised its 2028 operating profit forecast for SK Hynix by 24% to 454 trillion won (~$299.62 billion), citing sustained AI-related memory demand. However, Chey cautioned that sudden price jumps in DRAM and HBM could harm the long-term sustainability of the AI ecosystem.